semiconductor device
英 [ˌsemikənˈdʌktə(r) dɪˈvaɪs]
美 [ˈsemikəndʌktər dɪˈvaɪs]
网络 半导体器件; 固体器件; 半导体装置; 半导体组件; 半导体元件
英英释义
noun
- a conductor made with semiconducting material
双语例句
- H~ 1 error estimates for the finite volume element method along characteristics for two dimensional semiconductor device with heat conduction
二维热传导型半导体器件的特征有限体积元方法和H~1模分析 - The solution using a spline procedure, SADI, and a high-order compact finite difference ( HOC) method is presented for the hydrodynamic ( HD) model for semiconductor device simulation.
采用ADI与高阶紧致差分相结合的方法计算大型非对称稀疏矩阵，并实现了该算法在半导体器件模拟中的应用。 - Now, wire bonding has been the most popular interconnection technique in semiconductor device packaging.
目前，引线键合技术已经成为半导体封装中广泛应用的互连方法。 - Sound knowledge in semiconductor physics, semiconductor device testing and characterization.
具备半导体物理学，半导体设备测试和性能的相关知识。 - Complementary metal oxide semiconductor device
互补金属氧化物半导体器件 - And the thermal expansion coefficient and processing performance is similar to silicon, ceramics and other semiconductor device.
而且具有与硅、陶瓷等半导体器件相近的热膨胀系数和良好的加工性能。 - And this will contribute to the study and development of the power semiconductor device research in our country.
这对于我国功率半导体器件领域的研究与发展具有着重要的理论意义和实际意义。 - Semiconductor Device/ Circuit Mixed-Type Simulation and Its Application in HPM Effects
半导体器件/电路混合模拟及其在HPM效应中的应用 - Failure Analysis Application in Semiconductor Device R_c Failures
半导体器件金属互连电阻失效分析方法研究 - Heat sink for power semiconductor device
GB/T8446.1-1987电力半导体器件用散热器